Underfill flow guide structures and method of using same

ABSTRACT

Underfill flow guide structures and methods of using the same are provided with a module. In particular the underfill flow guide structures are integrated with a substrate and are configured to prevent air entrapment from occurring during capillary underfill processes.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of co-pending U.S.patent application Ser. No. 12/190,612, filed on Aug. 13, 2008, thecontents of which are incorporated by reference in their entiretyherein.

FIELD OF THE INVENTION

The invention relates to underfill flow guide structures and methods ofusing the same and, in particular, to underfill flow guide structureswhich prevent air entrapment from occurring during capillary underfillprocesses.

BACKGROUND

In typical manufacturing processes, a large number of semiconductordevices are formed on a singe wafer. After the semiconductor devices areformed, the wafer is sliced and diced so that each individualsemiconductor device is separated from the others formed on the wafer.The individual semiconductor devices are then packaged. Packagingprovides physical protection and also dissipates heat from thesemiconductor. The packaging, for example, in flip chip technology, alsoprovides leads between individual chips and an exterior of the package.The leads provide electrical connection between the chip and a printedcircuit board or other device.

In flip chip technology, for example, a series of C4 bumps are formed inan array on a surface of the flip chip. In the packaging, the C4 bumpsare attached to a substrate. One method of such packaging includesunderfill. In fact, underfill is required for almost all C4 products to,for example, prevent C4 corrosion and C4 fatigue fails due to thermalmismatch.

The standard industry process to apply underfill is through a capillaryflow underfill process. In this process, underfill is dispensed alongone or multiple edges of the chip and then flows under the chip bycapillary action. However, it is known that the flow of the underfill isirregular and unpredictable and can lead to voids around C4 bumps. Thesevoids can allow for C4 corrosion and dendritic growth, as well asthermal fatigue of C4s due to CTE mismatch between the chip and thesubstrate. These problems can ultimately lead to device failure andyield loss.

For example, as shown illustratively in FIG. 1A, during the capillaryaction the underfill has an irregular flow front, which becomes evenmore pronounced in finer pitched C4 products. As different portions ofthe flow front converge, voids or air pockets can develop around the C4bumps, as shown in FIG. 1B. Analysis under acoustic microscopy has shownthat flow fronts of the underfill can converge, resulting in entrappedair (caused by the non-uniform underfill flow). Large entrapments of airor voids are considered yield loss. The entrapment of air due tonon-uniform underfill flow underneath the chip is of especial concernfor fine-pitch solutions, which are required for newer technology chips.

Accordingly, there exists a need in the art to overcome the deficienciesand limitations described hereinabove.

SUMMARY

In a first aspect of the invention, a structure comprises a substratehaving bumps mounted thereon and underfill flow guide structures. Theunderfill flow guide structures integrated with the substrate areconfigured to uniformly guide underfill along the substrate duringcapillary underfill processing.

In another aspect of the invention, a module comprises a substratehaving C4 bumps mounted thereon and a carrier mounted to the substrateby the C4 bumps. Underfill is injected within a space formed between thesubstrate and the carrier. Underfill flow guide structures integratedwith the substrate are configured to uniformly guide the underfill alongthe substrate and within the space during underfill processing.

In still a further aspect of the invention, a method of forming a modulecomprising: injecting underfill within a space of the module at one ormore edges of a substrate forming the module; and directing theunderfill with a substantially uniform flow front with the space of themodule by underfill flow guide structures integrated with the substrate,thereby providing an underfill devoid of voids.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The present invention is described in the detailed description whichfollows, in reference to the noted plurality of drawings by way ofnon-limiting examples of exemplary embodiments of the present invention.It is noted that, according to common practice, the various features ofthe drawing are not to scale, and the dimensions of the various featuresare arbitrarily expanded or reduced for clarity.

FIG. 1A shows a non-uniform flow front of an underfill material;

FIG. 1B shows the formation of voids around C4 bumps;

FIG. 2A shows underfill flow guide structures in accordance with a firstaspect of the invention;

FIG. 2B shows a side view of the underfill flow guide structures of FIG.2A;

FIG. 3A shows underfill flow guide structures in accordance with asecond aspect of the invention;

FIG. 3B shows a side view of the underfill flow guide structures of FIG.3A;

FIG. 4 shows underfill flow guide structures in accordance with anotheraspect of the invention;

FIG. 5 shows a package using the underfill flow guide structure inaccordance with aspects of the invention; and

FIGS. 6A-6C show an underfill process implemented with the underfillflow guide structures in accordance with the invention.

DETAILED DESCRIPTION

The invention relates to underfill flow guide structures and methods ofusing the same and, in particular, to underfill flow guide structureswhich prevent air entrapment from occurring during underfill capillaryprocesses. In implementation, the underfill flow guide structures(topography) are integrated with the substrate (chip) to provide animproved flow path for the underfill flow. The underfill flow guidestructures can be integrated via a raised structure or a trench ortrough as discussed herein. Advantageously, the underfill flowstructures (e.g., guides) increase flow speed and prevent underfillvoids. The underfill flow guide structures of the present invention canbe implemented within the traditional flow of wafer and/or substrateprocessing.

Structures in Accordance with the Invention

FIG. 2A shows underfill flow guide structures in accordance with a firstaspect of the invention. In particular, the underfill flow guidestructures 14 are provided on a chip 10 and act as flow paths forunderfill as represented by the arrows in FIG. 2A. In this illustrativeembodiment, C4 bumps 12 are mounted to the chip (substrate) 10 (andadjacent to the underfill flow guide structures 14) using conventionaltechnologies. In accordance with a first aspect of the invention, theunderfill flow guide structures 14 are raised three dimensionalstructures, which create topography on the chip 10.

In accordance with the first aspect of the invention, the underfill flowguide structures 14 are configured to run parallel to one another aswell as two edges of the chip 14. The underfill flow guide structures 14are also adjacent to the C4 bumps 12 and are configured to extend toopposing edges of the chip 10. The underfill flow guide structures 14can also be provided at the edges of the chip 10. It should beunderstood that many different patterns and shapes of the underfill flowguide structures 14 are contemplated by the present invention such as,for example, straight, divergent, sinusoidal, a combination thereof,etc. In addition or alternatively, the pattern of the underfill flowguide structures 14 can also be intermittent, extend from an edge to anarea within the chip, from edge to edge, overlap or criss-cross, etc.Also, as noted above, it should be understood that the various featuresof the drawing are not to scale, and the dimensions of the variousfeatures are arbitrarily expanded or reduced for clarity.

In embodiments, the underfill flow guide structures 14 can be fabricatedduring wafer level processing. For example, the underfill flow guidestructures 14 can be fabricated from a photosensitive polyimide (PSPI)film during the wafer fabrication process, and more preferably with asecond layer of material (e.g., PSPI). It should be understood thatother materials such as other passivation materials (e.g., oxide, etc.)are also be contemplated by the present invention. In furtherembodiments, the underfill flow guide structures 14 can be patternedfrom wires (or other topographies on the chip 10) with an overlay of ahard passivation layer. In further embodiments, for example, theunderfill guide flow structures 14 can be formed using a greytone mask,as should be understood by those of skill in the art.

FIG. 2B shows a side view of the underfill flow guide structures of FIG.2A. As shown in FIG. 2B, the underfill flow guide structures 14 arepositioned between the C4 bumps 12. In embodiments, the underfill flowguide structures 14 are about 5-15 μm in height and preferably have anaspect ratio of 1:1; although other aspect ratios are also contemplatedby the present invention. For example, the underfill flow guidestructures can be about 4 microns high when formed from wires and anoverlay of hard passivation. Also, although the underfill flow guidestructures 14 are shown as oval in shape, other shapes are alsocontemplated by the present invention such as, for example, circular,rectangular, triangular or an irregular shape, depending on themanufacturing processes.

FIG. 3A shows underfill flow guide structures in accordance with asecond aspect of the invention. In particular, the underfill flow guidestructures 16 may be trenches or troughs which create a topography inthe chip 10. The underfill flow guide structures 16 may include a wavyor sinusoidal pattern, a straight line or other desired flow pathdepending on the C4 bump pattern. It should be understood that manydifferent patterns and shapes of the underfill flow guide structures 14are contemplated by the present invention such as, for example,straight, divergent, sinusoidal, a combination thereof, etc. In additionor alternatively, the pattern of the underfill flow guide structures 14can also be intermittent, extend from an edge to an area within thechip, from edge to edge, overlap or criss-cross, etc.

As in the first aspect of the invention, the underfill flow guidestructures 16 are adjacent to the C4 bumps 12 will act as flow paths forthe underfill as it flows past the C4 bumps 12. In this illustrativeembodiment, the underfill flow guide structures 16 can be patterned intothe oxide film of the chip 10, for example. The underfill flow guidestructures 14 are also adjacent to the C4 bumps 12 and can be at edgesof the chip 10.

Also, as noted above, in embodiments the underfill flow guide structures16 can be fabricated during wafer level processing. For example, theunderfill flow guide structures 16 can be formed through an etchingprocess in a passivation material such as, for example, oxide films.

FIG. 3B shows a side view of the underfill flow guide structures of FIG.3A. As shown in FIG. 3B, the underfill flow guide structures 16 arepositioned between the C4 bumps 10. In embodiments, the underfill flowguide structures 16 are about 2 microns deep when formed in anunderlying oxide film. Also, although the underfill flow guidestructures 16 are shown as semi-circular in shape, other shapes are alsocontemplated by the present invention such as, for example, semi-oval,semi-rectangular, triangular or an irregular shape, depending on themanufacturing processes.

FIG. 4 shows underfill flow guide structures in accordance with anotheraspect of the invention. In this aspect of the invention, underfill flowguide structures 18 are in a divergent pattern. In embodiments, theunderfill flow guide structures 18 of this aspect of the invention maybe formed by the processes described above, e.g., raised threedimensional structures, trenches or troughs. In further embodiments, theunderfill flow guide structures 18 can be formed using a grey tone mask.In this implementation, the grey tone can be used to form a structure inthe PSPI, as should be understood by those of skill in the art. Thepattern of the underfill flow guide structures 14 can also beintermittent, extend from an edge to an area within the chip, from edgeto any other edge, overlap or criss-cross, etc.

FIG. 5 shows a package using the underfill flow guide structures inaccordance with aspects of the invention. As shown in FIG. 5, using theunderfill flow guide structures 14 (or the underfill flow guidestructures 16 or 18 or any combination thereof), underfill 20 completelyfills the space between the chip 10 and a carrier 22. As such, theunderfill flow guide structures of the present invention prevent airentrapment and hence prevent voids from forming about the C4 bumps. Thisis due to the fact that the underfill flow guide structure prevent anirregular flow front of the underfill during capillary action, i.e.,provide a uniform flow front.

Methods in Accordance with the Invention

FIGS. 6A-6C show an underfill process implemented with the underfillflow guide structures in accordance with the invention. As shown in FIG.6A, the underfill is initially injected at an edge of the chip 10 by anunderfill tool 24, known to those of skill in the art. As shown in FIG.6B, as the underfill is injected at the edge of the chip 10, theunderfill is guided by the underfill flow guide structures (14, 16and/or 18), which provide a uniform flow path of the underfill. In thisprocess, the underfill fills the entire space between the chip 10 andthe substrate 22, directed by the underfill flow guide structures. FIG.6C represents the curing process of the underfill module.

Fabrication of Integrated Circuit Chips

The methods as described above is used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims, if applicable, areintended to include any structure, material, or act for performing thefunction in combination with other claimed elements as specificallyclaimed. The description of the present invention has been presented forpurposes of illustration and description, but is not intended to beexhaustive or limited to the invention in the form disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the invention.The embodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated. Accordingly, while the invention has beendescribed in terms of embodiments, those of skill in the art willrecognize that the invention can be practiced with modifications and inthe spirit and scope of the appended claims.

1. A method comprising: mounting bumps on a substrate; and formingunderfill flow guide structures on the substrate by patterning wireswith an overlay of hard substance, the underfill flow guide structuresbeing integrated with the substrate and formed between adjacent bumps,wherein the underfill flow guide structures are further formed touniformly guide underfill along the substrate during capillary underfillprocessing.
 2. The method of claim 1, wherein the bumps are formed ascontrolled collapse chip connections (C4).
 3. The method of claim 1,wherein the underfill flow guide structures are formed as raised threedimensional structures on the substrate.
 4. The method of claim 1,wherein the underfill flow guide structures are formed at a height ofabout 4 microns.
 5. The method of claim 1, wherein the underfill flowguide structures are formed in a pattern of at least one of: parallel,divergent, sinusoidal, intermittent, extending from an edge to an areawithin the chip, from edge to edge and overlap or criss-cross.
 6. Themethod of claim 1, wherein the hard substance is a polyimide.
 7. Themethod of claim 1, wherein the underfill guide flow structures areformed using a greytone mask.
 8. The method of claim 1, wherein theunderfill flow guide structures are formed to run parallel to opposingedges of the substrate and at least one row of the bumps.
 9. The methodof claim 1, wherein the underfill flow guide structures are sinusoidal.10. The method of claim 1, wherein the underfill flow guide structuresdiverge.
 11. A method of forming a module, comprising: forming C4 bumpson a substrate; mounting a carrier to the substrate by the C4 bumps;applying underfill within a space formed between the substrate and thecarrier; and forming underfill flow guide structures integrated with thesubstrate and located between adjacent bumps, and configured touniformly guide the underfill along the substrate and within the spaceduring underfill processing, wherein the underfill flow guide structuresare formed as wires with a overlay of a hard substance.
 12. The moduleof claim 11, wherein the hard substance is a polyimide layer.
 13. Themodule of claim 11, wherein the underfill flow guide structures areformed in a pattern of at least one of: parallel, divergent, sinusoidal,intermittent, extend from an edge to an area within the chip, from edgeto edge and overlap or criss-cross.
 14. A method of forming a module,comprising: injecting underfill within a space of the module at one ormore edges of a substrate forming the module; and directing theunderfill with a substantially uniform flow front with the space of themodule by underfill flow guide structures integrated with the substrate,thereby providing an underfill devoid of voids.